As Advanced Package Technology Developing Manager, you will be responsible for building and leading a team of engineers to develop advanced packaging process and equipment solutions for TSV Memory products at Micron’s new Taiwan manufacturing assembly site (MTB); you will need to have a deep understanding of packaging requirements, process capability, current state of equipment capability throughout the industry and the ability to incorporate best engineering practices for all backend assembly process; including but not limited to wafer level package process. Provide process packaging solutions on time to meet company and customer needs Work with cross-functional Global teams to roadmap future capabilities needed for packaging solutions Engage across a broad group of internal and external customers on Package Development, Performance and Qualification requirements, as well as Test Chip and Product Planning to help define program timelines and enablement requirements Work with Internal teams to put in place new capabilities to meet timelines Work with suppliers on new packaging technology / material / capability / equipment requirement Work with Process and Equipment counterparts in manufacturing on new equipment benchmarking Key member in driving KEG (Key Equipment Group) and KMG (Key Material Group) programs to maintain strong working relationship with key suppliers Ensure smooth transition from new process development, qualification, small volume production to high volume Lead a team of Engineers and Eng Assistants in the development and Qualification of new packaging process and equipment solutions to meet Business Unit requirements At initial transfer foster an environment where development and manufacturing teams are closely linked for pilot production input and process validation leading to successful High Volume Startup pilot line for new packages and work on yield improvement activities for initial production volume run Provide proper Documentation for product transfer to manufacturing Understand the capabilities of the internal sites and work with the Global team on packaging solutions that will be transferable while leveraging advances Technical Leadership Understand the future trend, technology and capabilities required for future packaging solutions Provide general packaging leadership and strategy to influence Micron’s technical direction Work with Internal teams to put in place new capabilities to meet future needs Foster an environment of innovation to enable novel processes Manage People and Develop Careers of the Section Team Members Manage a team of engineers and engineering assistants Foster a vibrant, energetic work environment, with a sense of urgency Provide training and career development for engineers and engineering assistants Supervise Technical Publication and Patent Disclosure Supervise and encourage engineers and engineering assistants in publishing technical papers and patent disclosure submission Ensure a Safe, Compliant, and Ethical Work Environment Maintain knowledge of, and apply, company safety, labor, and ethics policies Communicate requirements and expectations to leaders and external stakeholders Identify, resolve and / or report potential safety, security, and labor issues

台灣美光(台灣美光晶圓/台灣美光記憶體/美光亞太)是美商美光科技(Micron Technology, Inc.)在台子公司，美光科技成立於1978年，是全球前三大記憶體製造商，總部設立於美國愛達荷州波伊西市（Boise），並分別於美國、台灣、日本、新加坡、中國、歐洲等地設有研發設計或製造據點；全球員工超過3萬人。 台灣美光跨足半導體後段封測領域，以領先之姿，帶領亞洲半導體產業持續向上，讓世界供應鏈持續向台灣匯聚能量。台灣美光升級為集合晶圓製造、封裝測試於一體，並有研發團隊進駐的DRAM卓越製造中心。 我們提供高度多樣化的產品陣容，並與客戶密切合作，幫助他們開發整個記憶體系統。事實上，您也許每天都在使用我們的記憶體－在電腦、網路和伺服器應用中，在移動、嵌入式、消費者、汽車和工業設計中。 作為世界上最豐富的專利持有者之一，我們不斷反思、重鑄和精進新思路，給更廣泛的市場帶來革新並找出方法，使我們的技術能夠激發新的應用或對現有設計做出根本改進。 記憶體是我們的根基，是我們商業的核心競爭力。當我們展望未來時，將同時持續透過我們的核心記憶體業務和推動產品多樣化及技術來驅動創新與擴展新市場,以鞏固過去取得的成就。 美光在台灣 ●台灣美光晶圓科技股份有限公司(Micron Technology Taiwan, MTTW) 公司地址：桃園市龜山區復興三路667號(華亞科技園區) ●台灣美光記憶體股份有限公司(Micron Memory Taiwan, MMT) 公司地址：台中市后里區三豐路4段369號 ●美光亞太科技股份有限公司(MICRON TECHNOLOGY ASIA PACIFIC, INC.) 公司地址：台北市信義區基隆路一段333號25樓(2508室) ☆人力資源政策☆ 美光提供最佳產品給顧客並為股東及員工創造最大價值。對於員工我們提供具競爭性的薪資水準及創造優質的工作環境，吸引、留任及培育每位優秀員工。