We are looking for an expert in thermal/mechanical analysis, the engineer should understand the advanced packaging (PBGA/ TFBGA/ FlipChip/ POP/ CoWoS/ SiP/ Module), and thermal transfer behavior in electronic system. 1. Thermal and thermo-mechanical simulaiton of chip-package systems 2. Analysis thermal characteristic for package design optimization 3. Support thermal & thermo-mechanical issues/solutions for CP / FT / Reliability 4. Design or set up experiments and measure results for various thermal/mechanical DOEs 5. Development of innovative assembly concepts for electronic component 6. Research on materials and other solutions - - a). 3+ years exp. in thermal/Mechanical analysis is must b). Familiar with CAE tools, like ANSYS Icepak/Mechanical, Mentor Flotherm is must c). Familiar with JEDEC STD, like Rja, Rjb, Rjc is plus d). Familiar with Power DC, APD, ANSYS Fluent, Python, Matlab is plus e). Worked in system house or IC design house is plus

創意電子(GLOBAL UNICHIP CORP.，GUC)是客製化IC領導廠商(The customer ASIC Leader)，總部位於台灣，提供完整的先進客製化IC服務(The Advanced ASIC Services)，滿足當今創新科技公司獨一無二的業務與技術需求。 GUC獨特地結合先進技術、低功耗與內嵌式CPU設計能力，且搭配與台積公司(TSMC)以及各大封測公司密切合作的生產關鍵技術，最適合應用於先進通訊、運算與消費性電子的ASIC設計；GUC為眾所公認能夠發揮功耗/效能槓桿於極致，同時實現最快速上市的公司。GUC追求卓越的理念，實現了絕佳的功耗、速度、品質、良率與及時交貨。我們的目標就是要創新和提供世界級的彈性客製化IC服務，協助具有前瞻性的IC廠商提升其在市場的領導地位。 創意電子總部位於台灣新竹、另成立分部於台北內湖科學園區及台南，據點遍及中國大陸、歐洲、日本、韓國與北美，擁有全球知名度。創意電子已在台灣證券交易所掛牌上市，股票代號為3443。 「響應參與【產學研工程人才實務能力發展基地計畫】工程人才網路就業媒合平台」