This position is located in Hsinchu, Taiwan. The successful candidate will work closely with our sales team to demonstrate our tools for electroplating and physical vaporization deposition to our customers. He or she will also be responsible for working with customers to successfully apply our tools in support of the fabrication of both panel and wafer scale electronic packages and bumping processes. Specific duties include the following; • Develop and implement existing, as well as new electroplating and PVD processes to meet customer’s requirements • Optimize and determine tool parameters to produce a high quality product at customer sites • Work with customer to resolve engineering problems and perform trouble shooting and work with factory engineers to take corrective action • Familiar with chemical and electrochemical analytical techniques • Conduct field installation and customer training

https://www.youtube.com/watch?v=qnwYZnOeK7k&t=94s https://www.youtube.com/watch?v=sfy5qGytIHo ASM Pacific Technology Limited (ASMPT) is a leading integrated solutions provider in semiconductor and electronics industries. We have three business segments - Back-end Equipment, Materials and SMT Solutions with leading market positions with market cap of 48.581B(HK dollars). ASMPT is a world leader in the supply of semiconductor assembly and packaging equipment and materials as well as surface mount technology solutions. ASMPT was established in 1975. We are number One in Assembly and Packaging Equipment Market and SMT Equipment Market. We have 14500+ employees worldwide in 30+ countries and have 6 RD centres worldwide in Singapore, HK, Chengdu(China), Germany, England and Netherlands. We have 10 significant manufacturing operations worldwide in China, HK, Malaysia, Singapore and Germany.